Geehy Semiconductor Solutions on ICGOODFIND SiteMap
最新文章
- Tier IV to Open‑Source Its Automotive AI Chip Design – Free NPU Blueprint by 2027
- Kioxia & Sandisk Launch 9th‑Gen 2Tb QLC 3D NAND – 4.8Gb/s Interface, 33% Faster
- Vishay Q2 2026 Revenue Hits $918.6M – Book-to-Bill 1.32 on AI Server Component Boom
- China Bypasses EUV Lithography – Vertical Graphene Transistor Hits 132GHz for 6G Chips
- Taiyo Yuden Q2 MLCC Profit Surges 53.5% – AI Servers Drive Capacity Crunch
- Google AI Legends Leave to Launch Discovery Loop – A New Era in Automated Science
- onsemi Q2 Beats Estimates – AI Server Power Revenue Doubles to $500M in 2026
- TFME Establishes $140M Shenzhen Subsidiary – Expanding Beyond Packaging into Full Semiconductor Chain
- AOS Rolls Out AmpStack Vertical-Stack 80V Half-Bridge MOSFET – Replaces Two DFN5x6 Chips
- Navitas Q2 Revenue Jumps 22% QoQ – AI Data Center Power Drives Strategic Pivot
- Lattice Semiconductor Chip Series Overview | CPLD / FPGA / Power Management IC Application Guide
- Taiyo Yuden to Raise MLCC Prices Again in September – Second Hike This Year
- CXMT Surges Past $50B Market Cap on STAR Market Debut – Overtakes Intel & Tencent
- Broadcom Popular Communication Chips Cheat Sheet for Hardware Engineers | PHY, Switch, Automotive, Gateway
- TSMC to Raise Foundry Prices Up to 25% in 2027 – HPC Orders Face Premium
- ASML High-NA EUV Components Arrive in Albany – U.S. R&D Gets Next-Gen Lithography Boost
- Kyocera CEO: Semiconductor Parts Boom to Last Until 2030 – Ceramic & MLCC Capacity Ramping
- AOS Alpha & Omega Semiconductor Full Product Line Overview: Popular MOSFET & Power IC Selection Guide
- TFME H1 Profit Soars Up to 337% – AI & Storage Demand Fuel Packaging Boom
- World’s First 8-Inch 2D Semiconductor Pilot Line Goes Live in Shanghai
- Samsung Tapes Out Tesla AI5 Chip on 2nm at Taylor Fab – Mass Production Set for 2027
- Silex Buys ON Semi’s 200mm U.S. Fab for $40M – MEMS Capacity Play
- 2026 Hot IoT Module Combo: U-BLOX GNSS Positioning Modules + SIMCOM 2G Cellular Modules
- onsemi 1N5333BRLG: 5W Zener Diode for Circuit Protection and Voltage Regulation
- onsemi NLSV2T244MUTAG Dual-Bit Voltage Level Translator: Features and Applications
- onsemi FQT7N10LTF N-Channel MOSFET: Datasheet, Application Circuit, and Replacement Part Number
- onsemi NCP6332CMTAATBG: 5 MHz, 3 A Synchronous Buck Converter
- onsemi 6N139SDM High-Speed Optocoupler: Datasheet, Application Circuit, and Design Guide
- onsemi CAT25640VI-GT3 256-Kb SPI Serial EEPROM with High Reliability and Advanced Features
- onsemi NCP3334DADJR2G: High-Performance 150 mA Low-Dropout Linear Regulator
- High-Speed 3V LVTTL/LVCMOS to Differential PECL Translator: onsemi MC100EPT21DR2G
- YAGEO Resistor & Capacitor Product Line Introduction | Full Coverage of Common Models
- Yongxi Electronics Bets $1.4B on Advanced IC Packaging Megaproject – Will 8-Year Payoff Justify the Gamble?
- SemiAnalysis: ChangXin Memory to Overtake Micron as #3 DRAM Supplier by Year‑End 2026
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- Nearfield Instruments Raises $380M Series D – Largest Dutch Deep‑Tech Round Ever
- Nations Technologies Surges 20% on CPO MCU Roadmap for AI Optical Interconnects
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- WinCO Nova 1000mW Single‑Mode 980nm Pump Laser Chip Breaks Global Monopoly
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- Nokia Expands Pennsylvania Photonics Plant to Power AI Interconnect, Adds 250 Jobs
- Qualcomm in Talks to Acquire AI Chip Startup Tenstorrent for Up to $10 Billion
- Nvidia Pitches Vera CPU to China Clients: 88‑Core Arm Chip Launching August 2026
- SK Hynix to Triple Wafer Capacity by 2034, Picks Japan for First Overseas Fab
- Moore Threads Open‑Sources MusaCoder: LLM for GPU Kernel Generation, Trained Entirely on Domestic GPUs
- Samsung Plans New Advanced Packaging Plant in Gwangju to Boost HBM and AI Chip Capacity
- JCET Launches 3D Power Module Packaging Solution for AI Data Centers
- Nvidia’s New Vera CPU Picks SK Hynix DRAM as Memory Supplier
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- SK Group Halts SK Siltron Sale at Final Stage, Citing Supercycle and AI Strategy
- Geehy Launches Three G32A Auto MCUs – Mass Production for Body, Lighting, Thermal Management
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- STMicro and Arm Raise Forecasts on AI Infrastructure Boom – ST Sees $1B Data Center Revenue in 2026
- NXP LPC2927FBD144: A Comprehensive Technical Overview of the ARM9-Based Microcontroller
- NXP LPC2470FET208: A Comprehensive Technical Overview of the ARM7-Based Embedded Microcontroller
- NXP LPC2458FET180,551: A Comprehensive Technical Overview of the ARM7-Based Microcontroller
- NXP LPC2148FBD64,151: A Comprehensive Technical Overview of the ARM7-Based Microcontroller
- LPC4088FBD208,551: NXP's High-Performance ARM Cortex-M4 Microcontroller for Advanced Embedded Applications
- NXP LPC2146FBD64151: A Comprehensive Technical Overview of the ARM7-Based Microcontroller
- NXP LPC2919FBD144/01: A High-Performance ARM9-Based Microcontroller for Complex Embedded Applications
- LPC2364FBD: A Comprehensive Technical Overview of NXP's ARM7-Based Microcontroller
- Nuvoton NAU8421YG: 24‑Bit Stereo DAC with 128dB SNR, –99dB THD+N
- Marvell Q1 Revenue Hits Record $2.418B, Net Income Falls 81% on Acquisition Costs
- Unlocking the Power of the NXP LPC54101J256BD64QL: A Dual-Core Cortex-M4/M0+ Microcontroller for Advanced Embedded Designs
- Developing Embedded Systems with the NXP LPC2136 ARM7 Microcontroller
- LS1043ASN7MNLB: NXP's High-Performance Networking Processor for Next-Generation Embedded Systems
- LS1043AXE7PQB: NXP's High-Performance Networking Processor for Embedded Systems
- NXP LPC3220FET296: A Comprehensive Technical Overview of the ARM926EJ-S Microcontroller
- The NXP LPC2119 is a cornerstone microcontroller from NXP Semiconductors, renowned for its robust performance based on the ARM7TDMI-S core. This 16/32-bit RISC processor operates at up to 60 MHz, offe
- LPC2368FBD: NXP's ARM7-Based Microcontroller for Embedded Control and Communication
- NXP UBA2037TS: A Comprehensive Guide to the High-Voltage Half-Bridge Driver IC
- Huawei Kirin Chip Breaks 3GHz with Logic Folding, Unveils Tao Law at ISCAS 2026
- Alibaba Cloud Unveils Zhenwu M890 AI Chip and 128‑Card Supernode Server
- AMD’s Su Meets China VP He Lifeng, Pledges More Investment and Compute Partnership
- ChangXin Memory Q1 Profit Hits 4.6 B , R e v e n u e S u r g e s 719 4.6B,RevenueSurges7197.1B
- HuaHong Q1 Profit Soars 458% to $20.9M, 12-Inch Revenue Hits 62.7%
- NXP ISP1504ABS: A Comprehensive Technical Overview and Application Note
- The NXP UCB1400BE: An Integrated Touch Screen Controller and Audio Codec for Embedded Systems
- NXP PMEG3010BEA: A Comprehensive Technical Overview of the 30V, 1A Low VF Schottky Barrier Diode
- PSMN1R4-40YLD: NXP's Low-Ohm Power MOSFET for High-Efficiency Switching Applications
- NXP 74HC245BQ: A Comprehensive Technical Overview of the Octal Bus Transceiver
- NXP PMBT4401: A Comprehensive Technical Overview of the General-Purpose NPN Switching Transistor
- NXP 74AUP1G07GW: A Low-Power Single Buffer Gate with Open-Drain Output
- NXP BUK9M3R3-40HX: A High-Performance 40V MOSFET for Advanced Automotive and Industrial Applications
- AMD Quietly Takes Stake in Marvell as Nvidia Commits $2B to Strategic Partnership
- US Pressures Tesla to Move AI6.5 Chip Orders from TSMC to Intel
- NXP UJA1169ATK/F/3: A Comprehensive System Basis Chip for Automotive Networking and Power Management
- NXP UJA1169ATK/X/F: A Comprehensive System Basis Chip for Next-Generation Automotive Networks
- NXP NCF29A1MHN/0504G: A Comprehensive Technical Overview of the NFC Forum Type 5 Tag IC
- NXP P89LPC952FA: An In-Depth Technical Overview of the 8-bit Microcontroller
- NXP UJA1023T/2R04/C51: A Comprehensive Technical Overview of LIN System Basis Chips for Automotive Networks
- NXP TDA8024TT/C1/S1: A Comprehensive Technical Overview of Philips' Secure Smart Card Interface IC
- NXP S9S12ZVL32AMLCR: A Comprehensive Technical Overview of the 16-bit HCS12Z Microcontroller Family
- The NXP SPC5644AF0MVZ1R 32-Bit MCU: A High-Performance Automotive Microcontroller for Safety-Critical Applications
- TSMC Arizona’s Third Fab Tops Out, Set for 2nm Production
- Arrow Electronics Q1 Revenue Jumps 39% to $9.47B, Beats Wall Street Estimates
- Astera Labs Unveils 320‑Lane PCIe Switch – Industry’s Largest
- Lattice Buys Firmware Giant AMI for $1.65B – Aiming at AI Data Centers
- Unveiling the NXP LPC824M201JHI33: A Comprehensive Guide to its Architecture and Applications